1.
Which of the following is not taken into consideration when calculating the characteristic impedance for each layer?
A
Trace width
B
Trace height
C
Trace length
D
Distance of the trace to a plane
Loading practice questions
20 practice sets · Page 1 of 1
Which of the following is not taken into consideration when calculating the characteristic impedance for each layer?
Trace width
Trace height
Trace length
Distance of the trace to a plane
Which of the following drill document(s) must be provided to the fabricator to program their drilling equipment?
Drill Plot
Drill Drawing
NC Drill file
All of the above
When writing a requirement, the following word should be used to denote a requirement:
Should
Would
Can
Shall
When writing a requirement
The use of the word and is okay
The use of the word or is okay
Both of the above
None of the above
When is the earliest time one should communicate the bill of materials:
After fabrication has been started
After the boards have been fabricated
When the schematics are completed
After the layout is complete
What is the best method to provide a unique number for each component in the library?
Use the manufacturers part number
Use the vendors part number
Use a part number that is assign by the company you work for
Use a part number that you make up as you go
True Statement Statementor False Statement: ODB++ and Gerbers are proprietary formats
True Statement
False Statement
Though schematic tools do have to use a grid for pin connectivity, in theory, the grid used in a schematic is
In metric (mm)
In imperial (mils)
Both A and B interchangeably
Dimensionless
The use of 3D component models in the PCB layout can assist with
Electrical clearance
Component clearance
All of the above
None of the above
The solder paste files are generally produced
In the assembly file
In the fabrication files
Manually drawn
As part of the bill of materials
The solder mask has an impact on the trace impedance.
True Statement
False Statement
The grid used in a PCB layout tool should be
In metric (mm)
In imperial (mils)
Both A and B interchangeably
Either A or B
The declaration of Vias-In-Pads is determined in the
Assembly Notes
Fabrication Notes
Fabrication Files
Via stack up
The biggest factor when it comes to impedance is
Clock speed of the board crystal
The integrity of the signal from the output buffer of the sending component
The voltage level
The physical aspects of the board
Silk Screens
Are not required for every component
Are highly recommended for prototype boards
Are not necessary for production boards
All of the above
Select the answer that is True Statement: Mechanical layers
are unique to each project
are only declared in the PCB editor during layout
follow an IPC standard
should be used in the footprint libraries for courtyards and assembly files
PCBs should be fabricated with ................ layers.
Odd Number of
Even Number of
Any Number of
Microvias are the same as 1 layer blind or buried vias
True Statement
False Statement
During post assembly testing, it was found that a latch on one of the connectors cannot be fully extended due to other components located nearby. What would have prevented this situation from occurring?
The use of a 3D component
The use of a 3D component and component clearance rule
The use of a courtyard
The use of a courtyard and a component clearance rule
A well written requirement
has a complex sentence structure
uses technical verbiage
is testable by its nature
needs to be vague